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Technical Capability

  • Kaynes has a strong team for Process design in all stages of Manufacturing
  • Lean Manufacturing techniques are adopted at different stages for better
  • Kaynes Technical team has the understanding of various Hardware and Software platforms available across the industry along with Application specific requirements
  • Kaynes has carried out more than 40 Technology Transfers globally into India
  • Kaynes has separate Technical Teams for Electronics, Mechanical, Manufacturing Infrastructure and Manufacturing Process at all Stages
  • Kaynes has the Technical competence to Design and develop , Jigs , Fixtures , Test benches and Simulators for Manufacturing and Testing Processes
  • Kaynes has the competence for Building Custom Functional Simulators and Testers to meet the needs of Product Qualification and Validation
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STANDARD NAME
DESCRIPTION
1 IPC-A-600 For Acceptability Of Printed Circuit Boards
2 IPC-A-610 For Acceptability Of Printed Board Assemblies
3 JESD 625 Requirements for Handling Electrostatic-Discharge-Sensitive (ESDs) Devises
4 IPC-7095 Design and Assembly Process Implementation for BGAs
5 IPC-7912 Calculation Of DPMO and Manufacturing Indices for Printed Board Assemblies
6 IPC-7525 Stencil Design Guidelines
7 IPC/EIA J-STD-001 * Requirements for Soldered Electrical and Electronic Assemblies
8 IPC/JEDEC J-STD-033 Handling,Packing,Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
9 IPC-HDBK-830 Guidelines for Design, Selection and Application of Conformal Coatings
10 IPC – 7711 / 7721 Rework of Electronic Assemblies / Repair and Modification of Printed BDS and Electronic Assemblies
11 IPC-T-50 Terms and Definitions for Interconnecting and Packaging Electronic Circuits
12 IPC TM 650 IPC test Methods – Manual
13 ANSI/ASQ Z1.4-2003 /IS 2500 Sampling Procedures and Tables for Inspection By Attributes
14 IPC-7530 Guidelines for Temperature Profiling for Mass Soldering Process (Reflow and Wave Soldering)
15 AS55553 Counterfeit Electronic Parts; Avoidance, Detection, Mitigation, and Disposition
16 ESD TR53-01-06 Compliance Verification of ESD Protective Equipment and Materials
17 ANSI/ESD S20.20-2007 Protection of Electrical and Electronic Parts, Assemblies and Equipment (Excluding Electrically Initiated Explosive Devices)
18 ANSI/ESD S541-2008 Packaging Materials for ESD Sensitive Items
19 JSTD 001 Requirements for Soldered Electrical and Electronic Assemblies
20 JSTD 002 Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
21 JSTD 003 Solderability Tests for Printed Boards
22 JSTD 004 Requirements for Soldering Fluxes
23 JSTD 005 Requirements for Soldering Pastes
24 JSTD 006 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders
25 IPCA WHMA 620 Requirements and Acceptance for Cable and Wire Harness Assemblies
26 IEC 61340-5-1.0 Protection of electronic devices from electrostatic phenomena